A friend pointed this out to me - nice die shots of the new 7nm Zen 2 chiplet and the 12 (14?) IO die. The IO die is really interesting to see. There are so many different blobs, and they haven't actually required all the surface area they have available. It feels like a philosophy of the CCX is as pure and true to purpose as possible, then the IO die has basically anything else you might ever want - IF, DDR, PCI, USB, some secure enclave, all the 570 specific bits etc. It feels like they have very aggressively put as many things as they can think of on the IO die?